Angle-resolved Micro-Raman, a prospectively automatic method of stress measurement for electronic packaging of semiconductor

Abstract

Residual stress introduced during electronic packaging is one of the core factors affecting the efficiency, quality and reliability of advanced semiconductor devices. Therefore, it is important to reduce negative effect, even to increase positive influence through regulating the magnitude and distribution of residual stress on semiconductor devices, requiring a non-destructive, non-contact and automatic on-line method for the measurement of the surface and internal residual stress. This paper presented an angle-resolved Micro-Raman method for the measurement of the residual stress induced by electronic packaging of semiconductor.