Abstract

The short-channel effect (SCE) is the main problem of many metal-oxide-semiconductor field-effect transistor (MOSFET) industries. A lot of studies addressing the SCE effect have been conducted. One of the methods used for this is called SOI (silicon-on-insulator) technology. This method has been proven to effectively reduce the SCE effect. In this research paper, the electrical characteristic of an 18 nm gate length SOI PMOSFET was analyzed based on the prediction of the International Technology Roadmap for Semiconductors (ITRS). The threshold voltage would be the key characteristic in this research. Four process parameters were used with two noise factors in order to conduct nine sets of experiments using the L9 orthogonal array Taguchi method. At the end of the experiment, the best setting that was predicted by the Taguchi method would be utilized for the purpose of verification. The result shows that V TH after the optimization approach is closer to the nominal value (−0.533V), that is, within the appropriate range of ITRS 2013.

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