Abstract
This research is devoted to analyze the stress state and fatigue strength of two specimens made by a newly developed high-strength aluminium alloy produced by the wire arc additive manufacturing (WAAM) process. The relationship between fatigue strength and flaw size was calculated based on the root squared area – a parameter by conventional Murakami’s equation which is a widely used analytical approach for predicting fatigue resistance in metallic materials. The research involves the metallographic preparation process on two aluminum alloy labeled HS-Al-A and HS-Al-B followed by Vickers hardness measurement. Further, the image of the observed pores was processed and dimensioned using an open-sourced software ImageJ by considering pixels and actual distance as well as by defining image threshold value for measuring pore sizes. The analytical approach is conducted in order to describe the maximum stress intensity factor Kmax at the crack front and to assess the fatigue strength σFS. As final results, specimen A has an average pore area of ≈65 µm with Kmax of 333.75 MPa∙√m and σFS of 137 MPa, while specimen B has an average pore area of ≈42 µm with Kmax of 325.13 MPa∙√m and σFS of 153 MPa. Overall, this research allows the formulation of a method for estimating fatigue strength of large defects leading to a conclusion that flaws can influence the fatigue resistance of the material so that the bigger the flaw size is, the lower σFS and the higher the Kmax.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: JOURNAL OF APPLIED ENGINEERING DESIGN AND SIMULATION
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.