Abstract
Even as numerical models tackle increasingly complex solidification process and phenomena, analytical test problem can still be constructed to provide meaningful verification for the numerical modeling codes. In this paper, under the assumptions of zero surface energy, no crystal anisotropy, and infinite mobility, an analytical solution for the solidification of a solid seed in an undercooled binary melt is derived. This solution couples two previous literature solutions, one for the solidification of a seed in an undercooled pure melt, the other for the solidification of a binary alloy. The resulting solution provides insight into key crystal growth behavior and provides an excellent test solution for verification of more general multidimensional numerical solidification codes.
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