Analytical modeling to predict thermal shock failure and maximum temperature gradients of a glass panel

Abstract

The research has tackled thermal cracking distress in glass from a design perspective. The paper addresses a novel modeling framework, and provides closed-form solutions to predict thermally-induced stresses and the temperature profiles that cause glass to crack. The analytical formulation applies to monolithic glass and to plies of laminated glass or insulating glass.Results and discussion prove that the ratios between maximum thermal stress and temperature gradient have an upper bound, which is given, show that empirical approaches are largely inaccurate, and establish evidence that some code stipulations are wrong and some recommendations misleading.