Abstract
The GaN high-electron mobility transistor (HEMT) structure has been widely investigated, particularly for radio-frequency applications. This structure is suitable for high-frequency switching applications in power electronics because of the high breakdown field of GaN and the high mobility of the channel. In this paper, a physical model for predicting the power-switching operation of GaN-based HEMTs as a function of material and device parameters is proposed. Analytical equations for total losses and power dissipation density are derived and discussed both qualitatively and quantitatively.
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