Abstract
We developed a prediction method of power cycling (PC) lifetime affected by the cracks in the interconnect solder layer between the insulating substrate and the baseplate (the baseplate solder layer) in power modules. The baseplate solder layer sustains damage mainly during PC tests due to the recent improvement in the reliability of die-attach materials and the junctions between the chips and connecting wire. In this paper, we investigated a method that predicts the effect of cracks in the baseplate solder layer on the PC test. Cracks increase the thermal resistance and module temperature, both of which are key parameters of PC lifetime. Therefore, it is possible to calculate the lifetime using empirical equations of these parameters. We performed a PC test and verified that its calculation and result agree with high precision. We also discuss the relationship between the vertical cracks and PC lifetime in detail.
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