Abstract
†Elastic memory composite (EMC) materials consist of traditional fiber reinforcement (carbon, glass, etc.) and a fully cured thermoset shape-memory polymer resin. These novel materials are being considered for a wide range of deployable structures for space applications. At the elevated temperature used for packaging and deployment of EMC structures, the resin is several orders of magnitude less stiff than a typical composite polymer resin. Fiber microbuckling and laminate transverse (i.e., through-thickness) shear compliance behaviors resulting from this low-stiffness resin allow far greater packaging strains (i.e., higher bending curvatures) than is possible with traditional composites. These non-traditional behaviors are explored in this paper. Additionally, the applicability and limitations of using a commercial general-purpose finite-element code are explored through the analysis of a component-level EMC structure. The analysis yielded important insight into an experimentally observed failure mechanism, and aided in structural design changes and improvement of key performance metrics of the structure.
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