Analysis on the removal mechanism of disc grinding based on dynamic thermal–mechanical coupling

Abstract

Disc grinding is a commonly-utilized removal technology to generate the machining surface with higher precision. The material removal is caused by the force interaction between abrasives, which releases much heat during grinding. The dynamic thermal–mechanical coupling can be a crucial factor to influence the surface performance of the workpiece. However, previous studies on disc grinding are not enough for investigating the influence of the removal mechanism on the surface’s quality with dynamic thermal–mechanical coupling effect, which is caused by the double-side enclosed construction of grinding tool. To fill this gap, a novel coupled theoretical model is established based on effective abrasives dynamic removal. The moving trajectory of the discrete dynamic abrasives is deduced firstly. Meanwhile, the dynamic mechanical interaction is calculated by effective abrasives movements and height differences. Afterwards, the dynamic thermal relaxation is calculated by a finite difference method according to the effective abrasives moving trajectory and dynamic mechanical interactions, which is further validated by the finite element method. On account of the distribution of dynamic thermal–mechanical coupling, the uneven machining is found in disc grinding process. Furthermore, disc grinding experiments are performed to validate the analyzed regulations by the measurements of machining surface profile. The obtained findings are anticipated to be meaningful for improving disc grinding mechanism and optimization in wafer machining enterprises.