Abstract

This paper presents the results of analysis on dynamic operation of 3 kinds of IGBTs under conditions of soft and hard switching topologies. Voltage and current waveforms and power losses, electric field distributions and carriers behaviors inside the chips are studied through simulation and experiment. It is noted that the trench gate IGBT has advantages over the other types for the hard switching application and both the trench and planar gate IGBTs by epitaxial-wafer are suitable for soft switching application.

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