Abstract
Interface reactions between Sn–Zn lead-free solders and the Au/Ni electrolytic-plated Cu pad after isothermal aging were investigated. The intermetallic compounds at the interface between solder and the Au/Ni electrolytic-plated Cu pad were examined by field-emission scanning electron microscopy and transmission electron microscopy. During the reflow, Zn firstly reacted with Au and then was transformed to the β-AuZn (cubic phase, JCPDS 30-0608) compound in the bottom side of the solder. As aging time increased, γ-Ni5Zn21 (cubic phase, JCPDS 06-0653) compounds were formed on the Ni layer. Finally, the Ni5Zn21 phase divided by three layer was formed with grains of columnar shape, and the thickness of the layers was changed by aging time.
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