Analysis of thermal density and heat sink on dissipative nanofluid along magnetized sheet and applications in microelectronic cooling systems

Abstract

The objective of present analysis is to control excessive thermal behavior in microelectronic devices using heat sink and magnetic field. Improving technological innovation demands proper temperature evacuation in microelectronic components. A feasible method for cooling microelectronics is to use nanofluid, a novel heat-transport liquid. To achieve significant cooling, microelectronic devices must be small with specific operating liquids than regular liquids. The present work investigates the fluid motion and heat transmission properties of nanofluids as advanced cooling fluids for microelectronic coolant systems. A numerical technique is used to investigate the cooling mechanism using stretching surface. Computational fluid dynamics and 2D liquid movement simulation are employed to determine the mathematical model. The governing model is transformed with Keller box method and Newton Raphson technique through MATLAB program. The base liquid is water using laminar motion. The influence of nanoparticles volume fraction, heat sink, variable density and viscous dissipation in the base liquid on heat transmission efficiency of coolant devices is investigated. It is noticed that the fluid temperature decreases as heat sink increases. It is found that the excessive heat is reduced by using magnetic layer and heat sink. The present numerical mechanism is significant for the cooling of microelectronic devices.