Abstract
Owing to their superior electrical performance, multilayer ceramic capacitors (MLCCs) are widely applied in a variety of electronic devices. The acoustic noise of MLCCs is an important factor to be considered when selecting MLCCs for specific applications, such as smart phones. This noise is directly related to the vibration of the printed circuit board (PCB) on which MLCCs are mounted. Therefore, to improve the noise and vibration characteristics, this paper investigated the effects of soldering parameters on PCB vibration. Based on the findings, a novel soldering method that reduces vibration is described.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
