Abstract
ABSTRACTSilicon oxidation kinetics in the thin regime are studied by a unique method in which thermally grown as well as densified CVD-deposited oxides are incrementally reoxidized and measured. Strikingly higher oxidation rates are obtained through deposited oxides, as compared to thermal oxides, suggesting that oxidations are suppressed after an initial layer is grown rather than enhanced during initial layer formation. We show that these findings tend to support initial oxidation models based on stress.
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