Abstract
Chemical vapor deposition WSix films were formed with varying compositions and film thicknesses. The were films annealed in N2 for 30 min and their resistivities were measured. The maximum resistivity was obtained for annealing temperatures between 500 and 600 °C if the film was comparatively richer in tungsten and was thick. The film was analyzed by x-ray diffraction and secondary ion mass spectrometry. The maximum resistivity is considered to be related to crystallization, which changes amorphous WSix into a mainly hexagonal structure, and to the difference in the conduction mechanism of electrons between amorphous, hexagonal, and tetragonal WSi2. It is clear that impurities in the film do not contribute to the maximum resistivity. There is also no relationship between resistivity and the number of grains of tetragonal WSi2 per unit length for annealing below 600 °C.
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