Analysis of the Effect of Digital Power Ground Noise on Active Balun in UHF RFID SiP

Abstract

In recent, as the demand for integrating radio frequency identification (RFID) system to mobile electric appliances increases, there has been strong needs for small size, light weight, and low power consumption in RFID system. To reduce size of RFID system, system-in-package (SiP) technology has been applied to RFID system. However, there are many problems, as RFID system is integrated into a single package. One of those problems is noise coupling from noisy power/ground of digital logic circuits to noise sensitive circuits, such as RF and analog circuits. Not only package power/ground noise coupling but also on-chip substrate noise coupling could degrade the performance of RF circuit. Therefore, it is essential to analyze and solve various noise coupling problems in RFID SiP, to guarantee the performance of it. In this paper, we have analyzed the effect of digital power/ground noise coupling on the performance of active balun through modeling and simulation including chip and package level. Moreover, efficient LC filter is applied to a RF circuit to minimize package power/ground noise coupling to the RF circuit.