Abstract
The crack propagation mechanism of glass-ceramics is the theoretical basis for the improvement of surface quality after grinding. The unclear mechanism of the multi-scratch interference effect on the crack propagation of glass-ceramics makes it difficult to propose methods to suppress crack propagation and control strategies to improve the surface quality. This research is aimed at understanding the influence of interference between scratches on lateral crack propagation, material removal mode, and surface quality during the grinding of glass-ceramics. In this study, the stress field model of the interference effect is established to reveal the influence mechanism of the interference effect on crack propagation in glass-ceramics. The amplitude and orientation distribution of the characteristic stress for the lateral crack are analysed. The results show that an increase in amplitude and the influence range of tensile stress and expansion merging under interference promote the further propagation of lateral cracks and brittle removal of glass-ceramics. Multiple scratches experiments produced by single grit were conducted, emulating the interference caused by multiple grits, and they were analysed by an interference stress field prediction model. For glass-ceramics, lateral crack/brittle fracture phenomena are predominant in the case of multi-scratch/double-scratch, whereas major plastic deformations are dominated in the case of a single scratch. A significant reduction in the critical cut depth is noted with an increase in the interference intensity which corresponds to the number of scratches. This preliminary work enables the understanding of the implications of the interference effect on lateral crack propagation in grinding glass-ceramics and provides a scientific basis for the establishment of a control method to suppress crack propagation and improve grinding quality.
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