Abstract
The chip-on-glass bonding process is one of the most effective packaging methods that can satisfy the need for thin, large, low-cost and light display panels in the liquid crystal display (LCD) industry. This process uses an anisotropic conductive film (ACF) as the adhesion layer between the driver chip and the LCD panel and is based on thermocompressing bonding. Thus, the proper temperature conditions, such as temperature level and even distribution over the film, can play the vital role in the improvement of bonding performance, quality, and reliability. A finite element analysis model for predicting temperature distributions in all the components of the process equipment as well as the driver chip, the LCD panel and the ACF is presented. The accuracy of the developed model is verified by comparing the simulated temperature distribution with the actual one. Consequently, the model is used in determining the tooltip dimension to introduce proper temperature distribution to the driver chip and the film.
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