Analysis of temperature and speed effects on the drawing stress for improving the wire drawing process

Abstract

This paper deals with experimental investigations in order to study the influence of drawing conditions on temperature rise and drawing stress in cold drawn copper wires. In the multipass drawing machine, the temperature rise and drawing stress are measured with thermocouples and load cell systems, respectively, for different drawing speeds. The results obtained show that the drawing stress and temperature rise vary during the drawing process. This certainly comes from the variation of the friction coefficient and the flow stress of the material depending on the drawing speed. From the experimental results, a relationship between temperature rise, drawing stress and friction coefficient is built. Based on this, a modification of Avitzur’s model is presented. This new model can help to select the process parameters which satisfy the conditions of minimum drawing stress for copper material.