Abstract
A computational model for chemical reactions in plasmas has been developed and applied to the gas-phase chemistry of dry etching of silicon dioxide. An ab-initio molecular orbital method is used to determine the dissociation processes and the threshold energies for gases and neutral radicals. Plasma chemistry is calculated by the plasma chemical kinetic method. The chemical compositions of the dry etching plasmas were investigated for fluorocarbon gases. Calculated ion fluxes, electron temperatures, and densities agreed with experimental results within factors of three. The differences in plasma characteristics between CHF3/CH2F2 and C4F8 were attributed to differences in the products and threshold energies of the dissociation reactions. Correlations could be found between the composition of radicals in a plasma and the etch selectivity in C4F8.
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