Abstract

ABSTRACTThe motion under an applied stress of dislocations in silicon crystals is slowed and stopped by the presence of oxygen inthe material. A model is presented that quantitatively describes the inhibition of dislocation motion by accounting for the oxygen gettering to dislocations caused by diffusion and stress-enhanced migration. Drag on the dislocation motion ismodelled using the elastic interactions between the interstitial oxygen and the dislocation and the energy needed to breakbonds formed between silicon and aggregated oxygen atoms within the dislocation core. The predictions of the model agree quantitatively with the experimental data of Imai and Sumino.

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