Analysis of organic contaminants on Si wafers with TXRF-NEXAFS

Abstract

Organic contamination is starting to play an important role in the production and quality control of Si wafers. For the traceability of the source of contamination, information on the chemical binding conditions is very valuable. A near edge X-ray absorption fine structure (NEXAFS) investigation is the natural development of total reflection X-ray fluorescence (TXRF) analysis of the wafer surfaces able to solve the problem of speciation. The plane grating monochromator beamline for undulator radiation of the Physikalisch-Technische Bundesanstalt at the electron storage ring BESSY II, which provides photon energies between 30 eV and 1.9 keV for the specimen excitation, is an ideal excitation source for TXRF-NEXAFS experiments that require a high resolving power and a sufficient photon flux for trace analysis of low Z elements. The contaminants have been diluted and deposited as droplets on wafer pieces thoroughly cleaned after the cutting. The K edges of C, N, O have been examined. Some discrepancies have been found in the analysis of the same compounds in two different beamtimes; molecular orientation is pointed to as the cause for the difference in magnitude of the resonances. The unintentional contamination has been identified as mainly composed of aliphatic chains.