Analysis of Numerical Micromodulus Coupled with Influence Function for Brittle Materials via Bond-Based Peridynamics

Abstract

In this paper, the numerical micromodulus is derived for the plane stress problem to develop a new insight into the application of bond-based peridynamics. Considering the nonlocal property of peridynamics, the numerical micromodulus coupled with influence function provides a reasonable description of the long-range force effect. Through several numerical applications, the effectiveness of the numerical modulus coupled with various influence functions to simulate deformation and failure is analyzed. In addition, a load increment algorithm based on fictitious density is developed specifically for quasi-static problems. It is indicated that the introduction of the influence function can enhance the accuracy in deformation and failure simulation, which is valuable for the advancement and application of numerical micromoduli. Through a comprehensive trade-off between simulation accuracy and stability, the numerical micromodulus coupled with the exponential influence function proves to be the more effective option for brittle material.