Abstract
This work presents the results of a preliminary study conducted to assess the viability of using 3D printing techniques for the manufacturing of microwave passive circuits based on microstrip techniques, both for prototyping new low-cost devices and for fast and costless testing of new circuits designs. The study was aimed to test two crucial factors in the viability of these procedures: the performance of the circuit in terms of its functionality and the structural integrity of the resulting structure. A low-cost 3D printer is proposed for the dielectric substrate design of microstrip circuits. Standard PolyLactic Acid (PLA) material has been characterized in the microwaves frequencies for different substrate sizes and densities. To verify the proposed method, a low-pass stepped impedance filter was designed, simulated, and measured. Finally, a structural analysis using Non-Destructive Testing (NDT) ultrasonic techniques has been carried out based on deconvolution and resonant spectroscopy. Both, electronic and structural results, have shown the feasibility of using low-cost additive techniques in the design of microwave circuits. DOI: 10.5755/j01.eie.25.2.23202
Highlights
The main problem is the lack of materials for 3D printers with good conductive characteristics, similar to those provided by copper and other conductive materials used in electronics
Some studies have appeared in which sensors and other electronic devices are designed with 3D printers [5], [6]
The use of additive techniques based on lowcost 3D printers and standard plastic material for the design of passive microwave devices has been validated
Summary
In electronic devices design at RF and microwave frequencies, additive techniques are being used mainly in the design of waveguide devices and SIW (Substrate Integrated Waveguide) In this case, 3D printers are commonly used for the dielectric design and the metallization is done usually by chemical procedures [7], [8]. Errors in any of the previous, such as voids or bubbles in between the thermoplastic (PLA) layers or in the PLAEpoxy-copper interface, excess of epoxy, or lack of homogeneity in the density of the PLA layers, would compromise the structural integrity of the circuit, but its replicability and reliability and increase the electrical losses To perform this analysis, we propose the use of ultrasound as it is fast, cheap, and very accurate, and can be used without damaging the circuits for their further use. Spectroscopy [10], [11], applied to C-scans of the circuits to reveal any defect or structural problem
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
