Abstract

The microstructural and strengthening behavior of two CuMg alloys, with 0.2 and 0.5m.-% of Mg, were analyzed after severe plastic deformation by Equal Channel Angular Pressing (ECAP). Both alloys were passed through a 90° inner angle ECAP die at room temperature up to 16 passes following route Bc. The EBSD analysis of the deformed microstructure revealed a significant grain refinement after the 2nd pass. Average grain sizes as fine as 0.31 and 0.24μm for the CuMg0.2 and CuMg0.5, respectively, were obtained after 16 passes. The tensile strength of the ECAPed samples of the present CuMg alloys did not reach a saturation level, attaining 570 and 750MPa after 16 passes for the CuMg0.2 and CuMg0.5, respectively. The dependence of the yield stress on deformation (i.e. number of ECAP passes) and Mg content was evaluated in terms of the Hall–Petch effect (influence of grain size), dislocation density (through the subgrain hardening effect) and solid solution strengthening. Results indicated that the stronger effect comes from the subgrain microstructure rather than from High Angle Grain Boundaries (HAGB). A minor effect of the chemical composition was also noticed.

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