Abstract
Asymptotic waveform evaluation (AWE) is a new method of efficiently analyzing linear circuits. The authors illustrate the applicability of AWE to the analysis of multichip module (MCM) interconnect structures from chip level through packaging, through thick or thin film interconnect and back again. The algorithm is described. Many extensions have been made to the AWE algorithm to render it more suitable for solving large interconnect problems. The use of partitioned solution techniques, a technique for efficiently determining the moments of distributed elements, and the combination of the AWE and SPICE algorithms to handle interconnect problems with general nonlinearities is described. Examples of AWE analysis are included. >
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