Analysis of Machining Parameters of Wire Electric Discharge Machining Process on Polysilicon Material

Abstract

AbstractThe experimental investigation deals with wire electrical discharge machining (WEDM) of polycrystalline silicon ingot using zinc-coated brass wire as electrode, to analyze major technological response characteristics concerning cutting speed and kerf width. The experimental analysis is performed for cutting silicon ingots into wafers with the goal of minimizing kerf loss, facilitating the manufacture of thin wafers, and increasing productivity. The major goal of this article is to comprehend the impact of processing factors on the cutting process in order to obtain parametric circumstances that give high slicing rate, high productivity, and minimum kerf loss. Cutting silicon ingots in traditional machining to assist the manufacturing of solar cells are extremely tough for the semiconductor and solar industries. In this study, the WEDM non-conventional tool is used to cut polycrystalline silicon. Based on box Behnken’s design of experiments (BBDOEs), sixty-two sets of experimental trials are done to assess the effect of various input parameters such as Ton, Toff, IP, SGV, WF, Wt, and WP. In addition, for experimental inquiry, predictive modeling, and multi response optimization, response surface methodology (RSM), analysis of variance (ANOVA), and statistical techniques (desirability) are used. To study the surface properties, the machined surface morphology is examined using SEM and EDX.KeywordsWEDMPolycrystalline silicon ingotOFTASEMSurface morphologyDesirability function T on T off IPSGVWFWT and CS