Abstract
AbstractTheoretical chemical mechanical polishing local planarization models as a function of polishing time and film removal are reviewed, and re-derived in a systematic and correlative way. The derived models employ pad viscoelastic and relaxation properties to explain the experimental phenomena that step height local planarization is an exponential function of line width at the same line density, and also account for the affect of pattern density and polishing of two different materials at the same time on step height planarization.
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