Abstract
The effect of buoyancy on the flow and heat transfer in shrouded arrays of rectangular blocks is studied numerically. The problem considered is relevant to the cooling of electronic equipment made up of components mounted on horizontal circuit boards. The effects of orientation of the blocks, heat conduction within the shrouds, and fluid properties are considered. Detailed velocity and temperature fields are computed. The results show that buoyancy leads to a significant enhancement in heat transfer along with a smaller increase in pressure drop, with the greatest enhancement found when the heated blocks face upward. The secondary flow forms single-eddy patterns at low Rayleigh numbers, and both single- and multiple-eddy patterns at higher Rayleigh numbers.
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