Abstract
In this paper, we report an electrochemical study using cyclic voltammetry and chronoamperometry on the kinetic and nucleation mechanisms of electrodeposited copper on indium-doped tin oxide-coated glass substrates from sulfate solutions. The present investigation has been carried out in an acid solution at pH = 5. The Scharifker–Hills model was used to analyze current transients. At relatively low overpotentials, copper deposition is observed to follow a model that involves instantaneous nucleation and diffusion-controlled 3D growth. The diffusion coefficient for Cu2+ for various applied potentials is determined. Atomic force microscopy (AFM) has been used to check the surface morphology of the electrodeposited thin films.
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