Abstract
GaN etching damage by capacitively-coupled RF Ar plasma exposure is significantly dependent on gas pressure and exposure time. At a low gas pressure (10 mTorr), the N/Ga ratio decreases by the physical etching effect with increasing exposure time, while the GaN surface morphology is smooth. At a high gas pressure (50 mTorr), there are other effects such as UV radiation, by which the GaN surface morphology becomes rough as the exposure time increases from ∼ 60 min.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
