Abstract
AbstractA theoretical analysis is presented of the morphological evolution of transgranular voids in metallic thin films driven by capillarity, stress, and electromigration. This highly nonlinear and complex dynamics is analyzed through self-consistent numerical simulations based on a two-dimensional phenomenological model of a passivated interconnect. The analysis follows a systematic exploration of a six-dimensional parameter space determined by the strengths of the electric and stress fields, surface diffusion anisotropy, and the size of the void. Our simulation results reveal a very rich nonlinear dynamical picture of void morphological evolution mechanism, including faceting, wedge void and faceted slit formation through a facet selection process, and soliton-like surface wave propagation. These results are in very good agreement with experimental observations and have important implications for interconnect failure.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
