Abstract
Metal swarf has the advantage of being eco‐friendly due to their ability to be recycled and reused, in addition to being lightweight, energy‐absorbing, and cost‐effective. For practical applications in various industrial fields, effective and accurate modeling for each case should be developed in consideration of its physical properties. This study investigates the mechanical behavior of aluminum chip compaction employing a new computational simulation approach based on a pressure‐dependent porous continuum model. Two material parameters of densification rate (n) and the ratio of shear modulus (m) are proposed and adjusted for different swarf. The numerical results show good agreement with the experimentally obtained axial stress—relative density relation of three various samples, demonstrating a close relationship between the parameters n and the chip geometry. This study can be applied for further investigation and analysis utilizing metal swarf of different geometries in various industrial applications.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
