Abstract
Diamond surface channel field effect transistors were passivated with thin AlN layers grown by metal-organic chemical vapor deposition in order to improve the chemical stability of the surface-near p-type channel. Electrical characterization showed that the surface-near conductivity in the diamond is preserved during AlN overgrowth if the process temperature does not exceed 800 °C. However, the sheet carrier density is decreased by a factor of about 5 compared to the unpassivated hydrogen-terminated surface. A combination of TEM and XPS analysis showed that this effect is not induced by a partial modification of the surface termination or by a polarization of the AlN passivation. The preserved, but reduced surface-near conductivity in the diamond can however be explained by a hydrogen double bond between the diamond and the AlN film. Field-effect transistor structures fabricated on the passivated diamond substrates showed stable operation up drain-source voltages to −70 V and might therefore be promising candidates for future high-voltage applications.
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