Analysis of deformation of thin polyimide film by pre-strained silicone elastomer

Abstract

In this study, we analyze the deformation of the thin polyimide (PI) film on the pre-strained elastomer. When pre-strained elastomer bonded with pressure-sensitive adhesive (50 µm) and the thin PI film (under 1 μm thickness) containing rigid islands array and released mildly, the elastomer film is restored to its near initial state by the amount of pre-strain. At this time, if the compressive stiffness of the PI film is relatively small compared to the elastomeric film, the deformation occurs as much as the elastomer. In such a case, the PI film generates a wrinkle phenomenon, a special form of the compression behavior of the thin PI film. To prevent pixel area deformation, the PI panel uses rigid material placed in the vicinity of the light-emitting pixels and a metal bus-line matrix placed in the rigid pixel and soft area. However, in this case, when the deformation of the wrinkle-producing area is excessive, it can develop into folds and creases. Hence, PSA and elastomer films are placed on both sides of the thin PI panel containing rigid islands array bridged with a metal bus-line matrix for buckling analysis with the protection of the pixel area.