Abstract
Precision processing such as grinding of single crystal gallium nitride is processed through complex interactions between many diamond particles. However, single-grain scratching can only study the basic performance of abrasive grain processing, and cannot study the mutual influence of multi-abrasive grain processing. Therefore, this paper studies the situation of double scratching. The influence of the distance between two scratches on the crack initial load has been studied by the analysis model during simultaneous double scratching and continuous double scratching. During continuous double scratching, when the separation distance L < 1.8b, lateral cracks on adjacent side of the second scratch nucleate and expand under a smaller initial load than single-indenter scratching, and the smaller the L is, the smaller the corresponding initial load of lateral cracks will be. When the separation distance is 0.4b and 0.8b, the median crack nucleates at the middle of two scratches. During continuous double scratching, the median cracks always nucleate and expand at the bottom of the second scratch.
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