Analysis of Adaptive Sandwich Composite Beans with Piezoelectric Actuators and Sensors Using Coupled High-Order Layerwise Mechanics

Abstract

A high-order discrete layer theoretical framework and a finite element are presented for predicting the electrostatic response of sandwich beams with piezoelectric layers. A new layerwise coupled piezoelectric laminate theory is developed, in which quadratic and cubic fields are added to the in-plane displacement and electric potential approximation in each discrete layer, moreover interlaminar shear stress continuity is imposed through the thickness. The stiffness, piezoelectric and permittivity matrices are formulated from ply to structural level. A finite element method and a beam finite element are further developed and used to predict the electrostatic response of various beam configurations. Numerical results and comparisons with linear layerwise beam finite element predictions illustrate the accuracy and capability of the developed mechanics to efficiently capture the global and local stress response of smart piezoelectric composite beams, particularly those of high thickness sandwich foam cores and compliant layers.