Analysis of a cracked neo-Hookean substrate with initial stress under a rigid punch

Abstract

The coupling problem of a cracked neo-Hookean substrate with initial stress under a rigid punch is examined in the current work. Fourier series is used to transform the mixed boundary value problem(MBVP) into singular integral equations (SIEs). The obtained SIEs is solved by using Gauss-Chebyshev collocation method. The stress distributions on the contact zone and crack surface, and related singularities are present. The numerical experiments examine how the punch position, punch width, crack length and propagation parameter affect the stress field. The result showed that: for k = 1 and unchanged material property parameters, the incremental stress distribution on the initially stressed neo-Hookean base is very similar to the Cauchy stress distribution of the isotropic linear elastic base.