Analysis of 3D planar crack problems in one-dimensional hexagonal piezoelectric quasicrystals with thermal effect. part I: Theoretical formulations

Abstract

Theoretical and numerical investigations on three-dimensional (3D) planar crack problems in one-dimensional (1D) hexagonal piezoelectric quasicrystals (QCs) with thermal effect are performed systematically. Part I of this work derives a series of theoretical formulations that are then used to study the 3D planar crack problems in the QCs. The simple layer potential functions with the extended displacement discontinuities (EDDs) as the unknown variables and the general solution based on quasi-harmonic functions for the QCs under consideration are used to deduce the boundary equations that govern 3D planar crack problems. The hypersingular integral equation method is used to analyze the asymptotic singularities of the coupled thermal-electrical-phonon-phason fields near the crack edge. Expressions are then presented for the extended stress intensity factors (ESIFs) of a mixed model crack in terms of EDDs for arbitrarily-shaped cracks in the QCs, and the basic relationships between the energy release rate and the ESIFs are established. Closed-form solutions for some typical cracks, including an elliptical crack that is subjected to coupled electrical-phonon-phason loadings and a penny-shaped crack that is subjected to antisymmetric thermal loading, are determined via Fabrikant's analysis method. Additionally, both the physical quantities on the crack plane and the corresponding variables in the coupled thermal-electrical-phonon-phason field in the full space are given. The theoretical formulations derived in this paper provide a fundamental basis for development of the numerical approach proposed in Part II of our work, and can also serve as benchmarks for numerical solutions.