Analysis and Test of PCB via Hole Heat Dissipation Performance in Circuit Practice Course

Abstract

The project-driven teaching concept is increasingly recognized by universities. The circuit practice course is no longer a single circuit design and welding, but is driven by the realization of the specific parameter requirements of the project. The problem of heat and heat dissipation of printed circuit boards is a difficult problem to be solved in practical courses. The current electronic components are moving toward with lighter, smaller, and higher performance. This development trend has led to a significant increase in the heat per unit volume of the components, and the increase in device density has also made heat dissipation more difficult. This paper focuses on the discussion of the heat dissipation of the system hardware circuit. To obtain a more optimized heat dissipation effect, a special PCB process requirement is proposed. Using Icepak software for thermal simulation. After actual test to analyze the influence of the via hole on the heat dissipation, it is a good reference for PCB layout design. In the teaching process, students understand the concept of engineering, recognize the difference between courses and projects, and better improve students' ability to realize project parameters.