Abstract
Modern high-power white light-emitting diodes (LEDs) composed of multiple blue LED chips and yellow phosphor coatings have been successfully commercialized because of their high-luminous efficacy. The multiple-chip LED packages usually come with flat structures that have large surface areas for considerable heat loss. Starting from the analysis and modeling of the blue LED chip, this paper introduces the thermal path through the phosphor layer to form the white phosphor-coated (PC) white LED device model for photometric, electric, and thermal performance analysis. The power distribution of the blue LED chip and that of the PC white LED device are compared. Based on this new analysis, the increase in the heat dissipation coefficient, equivalent thermal resistance, and power loss caused by the phosphor coating can be quantified. New equations suitable for device manufacturers to qualify their devices and design engineers to optimize LED system designs are derived. The analytical results are in good agreement with the practical mesurements.
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