Analysis and Classification of Charge Trapping States in β-Ga2O3 Mosfets Using I-V and C-V in Dark and Illumination Conditions

Abstract

Beta-gallium oxide (β-Ga2O3) is a promising ultra-wide bandgap semiconductor for high power applications. Its breakdown electric field of 8 MV cm-1, a Baliga figure of merit 3-10 times larger than that of SiC and GaN, and the ability to be grown from the melt make it highly attractive for the semiconductor industry. Significant improvements have been made in β-Ga2O3 device performance for both high power and high frequency operation. Currently, aluminum oxide (Al2O3) is the preferred gate dielectric for β-Ga2O3 transistors due to its electron and hole barriers, and similar atomic structure. Process optimizations to improve the interface quality has been explored by chemical treatments1 to the β-Ga2O3 surface before dielectric deposition, during the deposition of Al2O3, and with post-deposition annealing. Therefore, there is a desire to understand and classify defects at and near the Al2O3/β-Ga2O3 interface. Here, we report on a study of the Al2O3/β-Ga2O3 interface and border traps in planar depletion-mode β-Ga2O3 MOSFETs using DC I-V and C-V measurements in dark and under illumination with wavelengths from 730 nm (1.7 eV) to 230 nm (5.4 eV). The MOSFETs are fabricated on a 50 nm Si-doped epitaxial layer with a target doping concentration of 2.4 x 1018 cm-3 grown on a (010) semi-insulating β-Ga2O3 substrate. A Ti/Al/Ni/Au metal stack is deposited and annealed to form the Ohmic contacts. Plasma-assisted atomic layer deposition (PE-ALD) is used to deposit the 20 nm Al2O3 gate dielectric. The fabricated transistor structures have a LG of 1.94 µm, LS of 0.5 µm, and LD varying from 0.5 µm, 5.5 µm, and 10.5 µm. Measurements were performed at room temperature. Most FETs exhibited a threshold voltage of approximately -4 V, high linearity, and ION/IOFF ratios between 107 – 109. Using the conductance method, we extract an interface trap state density, Dit, of 3 x 1011 eV-1 cm-2 up to 0.44 eV below the conduction band. Illumination is used to obtain deep trap concentration and behavior. We observe little to no change in IV and CV curves for wavelengths above 365 nm but see a significant voltage shift in the CV curves for illumination wavelengths between 365 nm (3.4 eV) to 230 nm (5.4 eV), indicating significant activated traps from 3.4 eV below the conduction band. We will present the analysis of photo-assisted CV and stress-CV curves at various wavelengths to obtain densities of fixed, fast, and slow trap states and discuss their impact on device performance.