Abstract
Multiple film cracking in a film/substrate system is analyzed in the present study. The system is subjected to residual stresses before loading. A constant displacement rate is applied unidirectionally to stretch the system. An analytical model is developed to derive the stress distribution in the system, and the film‐cracking problem is analyzed using both the strength and the energy criteria. The predicted crack spacing as a function of the applied strain is compared with experimental measurements of multiple cracking of SiOx films with various thicknesses on poly(ethylene terephthalate) substrates. Comparison is also made between the present and other predictions.
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