Abstract
This study presents the impact of gate length scaling on analog and radio frequency (RF) performance of a self- aligned multi-gate n-type In0.53Ga0.47As metal oxide semiconductor field effect transistor. The device is fabricated using a self-aligned method, air-bridge technology, and 8 nm thickness of the Al2O3 oxide layer with different gate lengths. The transconductance-to-normalized drain current ratio (gm/ID) method is implemented to investigate analog parameters. Moreover, gm and drain conductance (gD) as key parameters in analog performance of the device are evaluated with gm/ID and gate length variation, where gm and gD are both showing enhancement due to scaling of the gate length. Early voltage (VEA) and intrinsic voltage gain (AV) value presents a decreasing trend by shrinking the gate length. In addition, the results of RF measurement for cut-off and maximum oscillation frequency for devices with different gate lengths are compared.
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