Abstract
The utilization of phase-mask technology for the fabrication of an analog micro-optics profile with a thick photoresist was investigated. A two-dimensional phase-grating mask with pi phase depth can produce a desired analog variation of exposure intensity, which allows one to vary the thickness of an analog photoresist after its exposure by a photolithographic stepper and development of the photoresist. A two-dimensional phase-grating mask of square pixels was simulated, designed, and fabricated. The fabrication of analog micro-optics in a thick SPR-220 photoresist by use of this phase mask was also demonstrated.
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