Abstract
ABSTRACT An Ultrasonic Oblique Incidence Technique is proposed here to solve the problem of the detection of interfacial weakness between the adhesive and the adherend. This technique employs transverse waves with an angle of incidence chosen from numerically established angular characteristics for the reflection factor in the case of different boundary conditions. The interface with imperfections was modeled with bond rigidity of a finite value or with the so-called “smooth” boundary condition. The second approach proposed here, also utilizing oblique incidence, is based on plate wave behavior in a three layered medium with imperfections on the individual interfaces. A selection of the appropriate modes for the adhesion weakness detection was obtained by a numerical analysis of the dispersion curves. The experimental measurements were carried out on adhesively bonded aluminium specimens.
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