Abstract
An ultra-fast temporary bonding and release process was investigated for the improvement of 3D integration. The bonding scheme composes of two different kinds of polymer for release layer and adhesive layer. The submicron release layer is a positive photoresist with the characteristic of high UV absorption induced into the de-bonding procedure within 20 s. In addition, the adhesive layer provides robust mechanical strength for the wafer thinning process. Based on results, this structure is a potential candidate for temporary bonding and de-bonding technique in 3D integration.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
