Abstract

As electroexplosive devices (EEDs) are increasingly exposed to the general public, their possible accidental initiation due to their susceptibility to electromagnetic interference (EMI) becomes a greater concern. Commonly, unintended signals coupled to the EED have been attenuated by the insertion of an L-C filter in the leads of the EED. However, these have typically been bulky, heavy, and expensive, and often cannot be installed close to the EED itself, thereby reducing the effectiveness of the filter. This paper discusses a filter and an EED which are mounted on the same substrate using hybrid microelectronics technology and surface-mount components. The resulting structure is small, lightweight, inexpensive and mechanically robust. Also, this application further demonstrates a new EMI insensitive EED, the semiconductor junction igniter. An electrical model was developed for the filter and EED and was verified with impedance measurements. Voltage attenuation and power dissipation were calculated, and temperature of the devices under excitation was measured, to demonstrate the effectiveness of the filter.

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