An Original Interconnection Technique for an Electronic Payment Card

M Monnier,M Monneraye

doi:10.1155/apec.10.23

Abstract

This paper intends to illustrate, through a practical application, the possibilities of LEP foil flexible circuitry for mounting and interconnecting integrated circuits. This technique results in a high density packaging which is used here for the integration of two components, a microprocessor and a memory, in an electronic payment card.

Highlights

For about two years, newspapers have published many articles dealing with memory cards
Newspapers have published many articles dealing with memory cards. Numerous applications of such cards have been cited, some of them are certainly of interest, but for different reasons only the electronic payment card seems to be in a real development state today
Starting from the technique already described of a double-sided flexible circuitry on polyimide foil in which interconnection is achieved through metallized holes,[2] an dectronic payment card has been developed

Summary

INTRODUCTION

Newspapers have published many articles dealing with memory cards. Taking into account the problems of bendability of the card, it is necessary to remove the IC’s further off the area of maximum radius of curvature and reducing as much as possible the dimensions of this cavity, to locate it near the periphery of the card Such localization minimized either the effects of curvature or the stresses due to the pressure of the magnetic reading heads in the automatic cash dispensers or other magnetic systems. Starting from the technique already described of a double-sided flexible circuitry on polyimide foil in which interconnection is achieved through metallized holes,[2] an dectronic payment card has been developed It includes an 8021 (28 pins)microprocessor which is combined with a 2716 (24 pins) memory. At the end of this sequence, the interconnection circuit including 8 contacts is ready for chips mounting (Figure 2)

Possible methods of chips mounting

CONCLUSION