Abstract
The optimum spacing problem for four heated chips rested on a conductive substrate in a channel is solved by an operator-splitting pseudo-time-stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional equi-spaced arrangement is not an optimum option for mixed convection situation. An optimum thermal performance can be obtained when the center-to-center distances between the chips follow a geometric series. When the ratio is larger than 1.2, the maximum temperature and the maximum temperature difference can be decreased significantly compared to the ratio of 1.0.
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